Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working img{max-width:100%} Nikon 4S020-092-1 Processor Board

img{max-width:100%} Nikon 4S020-092-1 Processor Board PCB LIB-I/F NSR-1755G7A Step-and-Repeat Used

5080-192300-11 PULLEY NP8148C005-3 1

Model No: MS4316B

A plastic connector clip is chipped but the pins are straight

Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working img{max-width:100%} Nikon 4S020-092-1 Processor BoardRudolph Technologies AT SM Die Prep Kit F30 300mm Wafer Defect System Working Inventory # A 19531 Model No: AT SM Die Prep Kit Removed from a Rudolph Technologies F30 300mm Wafer Mounter & Defect Inspection System Included Components Part No: 734202, Rev. A Part No: F30 Chuck O Ring Part No: Retaining Nut NSK Part No: HGP NZ1 NKS Part No: AFE CA, X Y AXIS NKS Part No: LG2, Z AXIS This Rudolph Technologies AT SM Die Prep Kit is used working surplus.